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Corvalent Receives Award of Excellence from Intel Embedded and Communications Alliance

Scottsdale, Arizona (10/24/07) - Corvalent Corporation today received the 2007 Award of Excellence for outstanding Market Development Fund co-marketing providing the greatest number of approved and funded programs for an Affiliate Member at the Intel Embedded and Communications Alliance (ECA) event held on October 24th in Scottsdale, Arizona.

Corvalent has been supplying high-quality, long-life industrial motherboards and rugged systems since 1993. This award marks the first time Corvalent has received this honor at this annual industry ecosystem event. Accepting the Intel ECA MDF Alliance Award from Troy Smith, Director of the Intel Embedded and Communications Alliance, were President and CEO, Ed Trevis and Vice President of Business Development, Tom Krueger.

"This award is a symbol of just how far our company has come in the past year with our products, services and marketing," said Ed Trevis, President and CEO.

"We look forward to continuing our joint work with Intel and our strategic partners for the benefit of our customers and our long term growth," continued Trevis.

About Corvalent

Founded in 1993, Corvalent is the only embedded computing design and manufacturing provider to deliver long-life products, long-term cost savings and lasting relationships with customers, partners and employees. Corvalent is the only provider to deliver ten year product longevity.  Corvalent’s x86 platform has a proven track record of providing robust Intel-based solutions for industrial applications, including oil and gas, industrial automation, defense/military, automotive, mobile/rugged, security and surveillance, and medical applications.  As a single source delivering industrial design through full-scale manufacturing, Corvalent offers flexibility and growth through turnkey solutions, including rack mounted systems, mobile/handheld devices, embedded motherboards, embedded systems, and industrial display systems.